About us
About US
Founded in 2004, Hengkun commits itself to the R&D and industrialization of advanced‑semiconductor materials. It is one of the few domestic‑based enterprises capable of developing and mass‑producing critical materials for 12‑inch IC wafer manufacturing.
The company is mainly engaged in the research, production and sales of high‑end photoresist materials and precursor materials. Its products have achieved large‑scale volume supply, serving mainstream domestic 12‑inch IC wafer fabs and filling a number of domestic gaps in key IC materials.
About US
Founded in 2004, Hengkun commits itself to the R&D and industrialization of advanced‑semiconductor materials. It is one of the few domestic‑based enterprises capable of developing and mass‑producing critical materials for 12‑inch IC wafer manufacturing.
The company is mainly engaged in the research, production and sales of high‑end photoresist materials and precursor materials. Its products have achieved large‑scale volume supply, serving mainstream domestic 12‑inch IC wafer fabs and filling a number of domestic gaps in key IC materials.
Development History
2004
Foundation of Hengkun
2015
2015
Listed on the NEEQ
2017
2017
Qualified Supplier of Intel
2020
2020
Hengkun New Materials was established
2020
2020
Headquarters R&D‑Center Project Launched
2021
2021
Hengkun New Materials was established
2021
2021
Hefei Semiconductor‑Material Plant Project Launched
2023
2023
SOC & BARC Sales Ranked No.1 among Domestic Suppliers in China
2025
2025
Listed on the STAR Market
Corporate Culture
Drive technological progress with innovative materials, and build a smarter and more sustainable future.
Drive technological progress with innovative materials, and build a smarter and more sustainable future.
Drive technological progress with innovative materials, and build a smarter and more sustainable future.
Enterprise qualification
Focusing on R&D and industrialization of key IC materials, we strive for breakthroughs in core‑critical technologies. With sustained technical accumulation and innovation, the Company has secured numerous authoritative certifications, industry honors and market recognition.
Intellectual Property Rights
System Certifications
Platform Qualifications
Major Honors
Enterprise qualification
Fujian Post‑doctoral Innovation Base
XMU‑Hengkun Advanced‑Semiconductor‑Materials Joint‑Innovation‑Center
Fujian Sci‑tech Little‑Giant
National Key “Little‑Giant” Enterprise
National IP‑advantage Enterprise
Xiamen Sci‑tech Progress Award
National High‑tech Enterprise
Fujian Engineering Research Center
Fujian New‑type R&D Institution
Fujian Enterprise‑Tech Center
Fujian Industrial Leading‑team
Fujian Manufacturing Single‑Champion
Leading industrial enterprise in Fujian Province
Gazelle Enterprise of Fujian Province
"Fujian Provincial Little Giant Technology Enterprise"
Company Layout
Zhangzhou Lithography‑Material Base
Located in Zhangzhou High‑tech Zone, this base focuses on the R&D and manufacturing of high‑end photoresist and supporting materials for integrated circuits. Equipped with industry‑leading photoresist R&D & production facilities, ultra‑clean laboratories and workshops, it delivers independent R&D and industrialization capabilities.
The plant covers an area of 33,000 m² and commenced mass‑production delivery in May 2020.
Anhui Lithography‑Material Base
ituated in Xinzhan Semiconductor‑Material Industrial Park (Hefei), this 100‑mu base undertakes R&D, production and sales of IC semiconductor materials. It is now operational, with a planned annual output above 1,000 tons.
A vital hub for Hengkun’s domestic semiconductor‑material strategy, the base supplies photoresists, precursors, formulated chemicals and key raw materials. It extends our industrial layout and serves regional clients across Hefei, Wuhan, Nanjing and Shanghai, boosting our competitive edge and capacity scale.
Dalian Precursor‑Material Base
Situated in Dalian Songmudao Chemical Industrial Park, this 30,000‑m² base develops, manufactures and markets ultra‑high‑purity IC precursors. Phase‑I launched in 2020 with 1,500‑ton annual capacity.
Phase‑I TEOS (9N purity, 99.9999999%) meets international advanced standards and is being mass‑delivered. Phase‑II covers R&D and industrialization of additional silicon‑based and metal‑based precursors.
Rooted in Chip-technology and Starting from the Core
No shortcuts exist in scientific research; faith and perseverance pave the way. Through tens of thousands of trials, we began from zero and turned impossible goals into domestic breakthroughs, advancing China’s chip sector. We tackle key IC‑material projects and embody technological self‑reliance with real‑world achievements.
Now we strive for advanced photoresists, precursors and frontier semiconductor materials. From catch‑up to surpassing and leading, we build firm confidence for China’s semiconductor future.
