On December 23, the signing and unveiling ceremony for the "Xiamen University-Hengkun Technology Advanced Semiconductor Materials Joint Innovation Center" (hereinafter referred to as the "Joint Innovation Center") was held at the Science and Art Center of Xiamen University's Siming Campus. Professor You Yancheng, member of the Standing Committee of the Party Committee and Vice President of Xiamen University, Professor Sun Shigang, CAS Member and leading expert in technology at Xiamen University's High-end Electronic Chemicals National Engineering Research Center (reorganized) (hereinafter referred to as the "Engineering Center"), Xu Mo, former member of the Standing Committee and Secretary General of the Xiamen Municipal Party Committee, Sui Guoyu, Deputy Director of the Management Committee of Xiamen Haicang Taiwan Investment Zone, Peng Junfeng, member of the Party Leadership Group and Chief Engineer of Xiamen Industry and Information Technology Bureau, Huang Ruiyun, Deputy Director of the High-tech Division of Xiamen Development and Reform Commission, and other municipal and university leaders, as well as Yi Rongkun, Chairman of Xiamen Hengkun New Material Technology Co., Ltd. (hereinafter referred to as "Hengkun Technology"), and other enterprise guests attended the signing and unveiling ceremony. The ceremony was presided over by Professor Ji Rongrong, Director of the Science and Technology Department of Xiamen University.

(Image | Scene of the Joint Innovation Center's signing and unveiling ceremony)

The Joint Innovation Center is a high-level university-enterprise cooperation center jointly established by Xiamen University and Hengkun Technology, based on Xiamen University's characteristic advantages in semiconductor and chemical engineering research and development, as well as Hengkun Technology's market advantages in the field of integrated circuit photoresist.

. The Joint Innovation Center, with the Engineering Center as its key supporting unit and semiconductor advanced materials research and development as its primary research direction, aims to facilitate the product realization process from electronic chemical development, concept verification, pilot equipment operation optimization, engineering simulation to industrial application, providing comprehensive solutions for key materials in advanced processes of integrated circuit chip manufacturing.

(Photo | Group Photo)

In his speech, You Yancheng mentioned that General Secretary Xi Jinping visited Fujian and delivered an important speech, explicitly pointing out the need to forge a new path in promoting the deep integration of technological innovation and industrial innovation. On the occasion of the 20th anniversary of the establishment of the "Xiamen National Semiconductor Lighting Engineering High-tech Industrialization Base", the establishment of the Joint Innovation Center represents a solid step taken by both schools and enterprises in promoting the deep integration of technological innovation and industrial innovation. It is also an important measure for schools and enterprises to jointly embark on a new journey and serve the semiconductor industry in Xiamen to a new level. It is expected that through this in-depth cooperation, both schools and enterprises will build information platforms such as project libraries, talent libraries, and scientific and technological literature libraries for basic research and engineering applications, achieve resource sharing and complementary advantages, and further explore new modes and paths of industry-university-research cooperation in more fields and at deeper levels, contributing intellectual strength to the development of China's semiconductor materials field.

Xu Mo expressed his expectation that the Joint Innovation Center, with the strong support of Xiamen City and Haicang District, will make greater contributions to solving China's "bottleneck" technological problems. He put forward three suggestions for the development of the Joint Innovation Center: First, the standpoint should be high, based on Xiamen's unique geographical advantages, and solidly tackle key technological challenges; second, the thinking should be innovative, actively respond to the requirements of the times, take the initiative to "go out", and strengthen exchanges and cooperation with various innovation entities and industrial entities through "virtual integration", making achievements in promoting the deep integration of technological innovation and industrial innovation; Thirdly, actions must be practical, integrating multiple forces to set an example and model for the construction of high-level scientific and technological innovation platforms, making greater contributions to further promoting technological innovation and industrial development.

Yi Rongkun stated that Hengkun Technology has been continuously committed to solving the "bottleneck" problem of semiconductor materials and striving to fill the domestic gap. Nowadays, Hengkun Technology has achieved breakthroughs in some core technologies of lithography materials and applied them to advanced semiconductor manufacturing processes. However, there is still a significant gap between China and foreign countries in the fields of high-end photoresists, upstream raw materials, small molecule additives, and high-purity solvents. After the establishment of the Joint Innovation Center, it will focus on industry technical challenges, carry out key technological breakthroughs, and organically combine the scientific research advantages of Xiamen University, the market advantages of enterprises, and the policy advantages of the government to form a good situation of collaborative innovation and common development, contributing wisdom and strength to the development of the semiconductor and integrated circuit industries.

Sun Shigang pointed out that semiconductor materials, as the cornerstone of the semiconductor industry, are at the upstream of the entire semiconductor industry chain and play an important supporting role in the development of the semiconductor industry. Facing the current severe and challenging international situation, Hengkun Technology has achieved partial domestic substitution in the field of lithography and continuously strengthened the dominant position of enterprises in technological innovation. The Engineering Center is a high-level scientific research platform jointly established by the city and the university, bringing together the advantages and profound accumulation of multiple colleges, disciplines, and platforms of Xiamen University, focusing on the research of high-end electronic chemicals and electronic plating related technologies. In the future, it is expected that both the university and the enterprise will follow the cooperation model of "Hengkun sets the questions, Xiamen University solves the problems", deeply cultivating the field of photoresists while continuously extending the cooperation content along the industrial chain, complementing and strengthening the leading industries such as semiconductor and integrated circuits. At the same time, he pointed out that while strengthening technological breakthroughs, both the university and the enterprise need to further enhance cooperation in talent cultivation and jointly build a highland for talent cultivation.

Subsequently, Yi Rongkun and Professor Hong Wenjing, Vice Dean of the School of Chemistry and Chemical Engineering of Xiamen University and leader of the reorganization working group of the National Engineering Research Center for High-end Electronic Chemicals, signed on behalf of both the university and the enterprise. You Yancheng, Sun Shigang, Xu Mo, Sui Guoyu, Peng Junfeng, Huang Ruiyun, Yi Rongkun, and Hong Wenjing jointly unveiled the Joint Innovation Center.

During the symposium and exchange session, based on the previous sufficient communication and substantive cooperation, both the school and the enterprise conducted open discussions and exchanges around the cooperation mechanism, talent cultivation, and technological breakthroughs.

Xiamen Hengkun New Material Technology Co., Ltd. is an integrated circuit enterprise dedicated to the research, development, production, and sales of advanced semiconductor materials. The establishment of this Joint Innovation Center marks an important milestone for both the school and the enterprise, based on the field of advanced semiconductor materials, aiming to tackle the "bottleneck" issues in the semiconductor and integrated circuit industry chain through deep and multi-dimensional cooperation. It will inject strong momentum into the transformation, upgrading, and high-quality development of related industries, cultivate and export composite high-end talents for the technological innovation and development of the country and region, and make due contributions to promoting technological progress and social development.